[IWFPE 2015] AUO’s Bendable AMOLED

During the IWFPE 2015 (November 4-6) held in Jeonju, South Korea, AUO gave a presentation on bendable AMOLED’s concept and technology first revealed in August.

AUO’s R&D manager Terence Lai reported that the bendable AMOELD can actualize new user interface through applying display’s bending characteristics and this can be the innovation that could change the existing touch interface.

AUO’s bendable AMOLED is 5inch with 295 PPI using the LTPS TFT and hybrid encapsulation with top emission structure. It has 02.mm thickness and through bending sensor of file type, it can process diverse functions by detecting different bending directions.

Current flexible AMOLED trend is moving from curved to foldable, jumping past bendable. Key panel companies and research laboratories are focusing on developing foldable.

It is anticipated that the AUO’s bendable AMOLED panel will provide new direction for the flexible AMOLED development that is heading toward foldable. Development of applications suitable to bendable and functions that utilizes bending characteristics are expected to be key issues.